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 ILX558K
5340-pixel x 3-line CCD Linear Sensor (Color)
Description The ILX558K is a reduction type CCD linear sensor developed for color image scanner. This sensor reads A4-size documents at a density of 600DPI. Features * Number of effective pixels: 16020 pixels (5340 pixels x 3) * Pixel size: 4m x 4m (4m pitch) * Distance between line: 32m (8 lines) * Single-sided readout * Ultra low lag/High sensitivity * Single 12V power supply * Maximum data rate: 10MHz/Color * Input clock pulse: CMOS 5V drive * Number of output: 3 (R, G, B) * Package: 22-pin Plastic DIP (400mil) Absolute Maximum Ratings * Supply voltage VDD * Operating temperature Pin Configuration (Top View) 22 pin DIP (Plastic)
Block Diagram
12 ROG-G 14 ROG-R 11 ROG-B Driver
S5340 D70 D74 D75
Driver
15 -10 to +55
V C
D74 D75
Driver
S5340 D70 D74 D75
CCD register
CCD register
CCD register
Read out gate
Read out gate
Read out gate
Green
Blue
Red
10 13 1 4 2
1
1
VDD NC NC NC NC NC
4 5
G R B
19 VOUT-R
Output amplifier Output amplifier Output amplifier CLP
18 NC 17 NC
22
6 7 8 9
VOUT-R 19
16 NC 15 NC 14 ROG-R 13 1
5340 5340 5340
2 10 ROG-B 11
12 ROG-G
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
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E02951-PS
VOUT-G
VOUT-B 20
3
GND
VDD
RS
VOUT-G
3
20 VOUT-B
D18 D19
D18 D19
D18 D19
GND
1
2
21 NC
D69 S1
D69 S1
D69 S1
RS
1
22 CLP
1
2
S5340 D70
ILX558K
Pin Description Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol RS GND VOUT-G VDD NC NC NC NC NC 2 ROG-B GND Signal output (green) 12V power supply NC NC NC NC NC Clock pulse input Clock pulse input Description Clock pulse input Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol ROG-G 1 ROG-R NC NC NC NC VOUT-R VOUT-B NC CLP Description Clock pulse input Clock pulse input Clock pulse input NC NC NC NC Signal output (red) Signal output (blue) NC Clock pulse input
Recommended Supply Voltage Item VDD Min. 11.4 Typ. 12 Max. 12.6 Unit V
Clock Characteristics Item Input capacitance of 1, 2 Input capacitance of RS Input capacitance of CLP Input capacitance of ROG Symbol C1, C2 CRS CCLP CROG Min. -- -- -- -- Typ. 500 10 10 10 Max. -- -- -- -- Unit pF pF pF pF
Clock Frequency Item Frequency of 1, 2, RS, CLP Symbol f1, f2, fRS, fCLP Min. -- Typ. 1 Max. 10 Unit MHz
Input Clock Pulse Voltage Conditions Item 1, 2, RS, CLP, ROG pulse voltage High level Low level Min. 4.75 -- Typ. 5.0 0 Max. 5.25 0.1 Unit V V
-2-
ILX558K
Electro-optical Characteristics (Note 1) (Ta = 25C, VDD = 12V, fRS = 1MHz, Input clock = 5Vp-p, Light source = 3200K, IR cut filter CM-500S (t = 1.0mm)) Item Red Sensitivity Sensitivity nonuniformity Saturation output voltage Red Saturation exposure Dark voltage average Dark signal nonuniformity Image lag Supply current Total transfer efficiency Output impedance Offset level Green Blue Green Blue Symbol RR RG RB PRNU VSAT SER SEG SEB VDRK DSNU IL IVDD TTE ZO VOS Min. 1.7 2.0 1.6 -- 2.5 -- -- -- -- -- -- -- 92 -- -- Typ. 2.6 3.1 2.5 4 3.0 1.15 0.97 1.2 2 4 0.02 30 98 240 5.6 Max. 3.5 4.2 3.4 20 -- -- -- -- 5 12 -- 50 -- -- -- mV mV % mA % V Note 6 Note 7 -- -- -- Note 8 lx * s Note 5 % V Note 3 Note 4 V/(lx * s) Note 2 Unit Remarks
Notes: 1. In accordance with the given electro-optical characteristics, the black level is defined as the average value of D18, D19 to D67. 2. For the sensitivity test light is applied with a uniform intensity of illumination. 3. PRNU is defined as indicated below. Ray incidence conditions are the same as for Note 2. VOUT = 500mV (typ.) PRNU = (VMAX - VMIN)/2 VAVE x 100 [%]
When the 5340 pixels are divided into blobks of 100, the maximum output of each block is set to VMAX, the minimum output to VMIN and the average output to VAVE. 4. Use below the minimum value of the saturation output voltage. 5. Saturation exposure is defined as follows. SE = VSAT R
Where R indicates RR, RG, RB, and SE indicates SER, SEG, SEB. 6. Optical signal accumulated time int stands at 5.5ms. 7. VOUT-G = 500mV (typ.) VOUT 8. Vos is defined as indicated bellow. VOUT indicates VOUT-R, VOUT-G and VOUT-B.
VOS GND
-3-
Clock Timing Chart 1
ROG
5 0
5414 S5338 S5339 S5340 D67 D68 D69 D70 D71 D19 D74 D17 D18 S1 5415 D75
1
2 D2
1
5 0
2
5 0
RS
5 0
CLP
5 0
D1
D3
3
VOUT Optical black (50 pixels) Dummy signal (69 pixels) 1-line output period (5415 pixels)
Note) The transfer pulses (1, 2) must have more than 5415 cycles. VOUT indicates VOUT-R, VOUT-G, VOUT-B. ROG indicates ROG-R, ROG-G, ROG-B.
ILX558K
S2
-4-
ILX558K
Clock Timing Chart 2
t4 ROG t2 t6 1 t7 t5
t1
t3
2
Clock Timing Chart 3
t7 1 t6
2 t9 t10
RS
t8 t14 t15
t16 CLP
t17
t13 t11 t12
VOUT
-5-
ILX558K
Clock Pulse Recommended Timing Item ROG, 1 pulse timing ROG pulse high level period ROG, 1 pulse timing ROG pulse rise time ROG pulse fall time 1 pulse rise time/2 pulse fall time 1 pulse fall time/2 pulse rise time RS pulse high level period RS pulse rise time RS pulse fall time Signal output delay time CLP pulse high level period CLP pulse timing CLP pulse rise time CLP pulse fall time Symbol t1 t2 t3 t4 t5 t6 t7 t8 t9 t10 t11 t12 t13 t14 t15 t16 t17 Min. 50 3 1 0 0 0 0 30 0 0 -- -- 30 10 5 0 0 Typ. 100 5 2 5 5 20 20 501 20 20 50 20 100 100 50 20 20 Max. -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Unit ns s s ns ns ns ns ns ns ns ns ns ns ns ns ns ns
1 These timing are the recommended condition under fRS = 1MHz.
-6-
Application Circuit
CLP
500 VOUT-B
500 VOUT-R
ROG-R
1
ROG-G
IC1
IC1
Tr1
100
Tr1
100
100
100
2
100
22
CLP
21
NC
20
VOUT-B
19
VOUT-R
18
NC
17
NC
16
NC
15
NC
14
ROG-R
13
1
12
ROG-G
12V
1
2
3
4
5
6
7
8
9
10
0.1F
47F/ 16V
100 IC1 RS
100 Tr1 VOUT-G 500
2
100 IC1 2 ROG-B
Data rate fRS = 1MHz
IC1: 74AC04 Tr1: 2SC2785
ROG-B
VOUT-G
GND
RS
VDD
NC
NC
NC
NC
NC
2
-7-
11
ILX558K
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
ILX558K
Example of Representative Characteristics
Spectral sensitivity characteristics (Standard characteristics)
1.0 0.9 B 0.8 G R
Relative sensitivity
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 Wavelength [nm] 600 650 700
-8-
ILX558K
Notes of Handling 1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non chargeable gloves, clothes or material. Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for prevention of static charges. 2) Notes on Handling CCD Packages The following points should be observed when handling and installing packages. a) Remain within the following limits when applying static load to the package: (1) Compressive strength: 39N/surface (Do not apply load more than 0.7mm inside the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength: 0.9Nm
Cover glass Plastic portion 39N 29N 29N 0.9Nm
Ceramic portion (1)
Adhesive (2) (3) (4)
b) In addition, if a load is applied to the entire surface by a hard component, bending stress may be generated and the package may fracture, etc., depending on the flatness of the ceramic portion. Therefore, for installation, either use an elastic load, such as a spring plate, or an adhesive. c) Be aware that any of the following can cause the package to crack or dust to be generated. (1) Applying repetitive bending stress to the external leads. (2) Applying heat to the external leads for an extended period of time with soldering iron. (3) Rapid cooling or heating. (4) Prying the plastic portion and ceramic portion away at a support point of the adhesive layer. (5) Applying the metal a crash or a rub against the plastic portion. Note that the preceding notes should also be observed when removing a component from a board after it has already been soldered. d) The notch of the plastic portion is used for directional index, and that can not be used for reference of fixing. In addition, the cover glass and seal resin may overlap with the notch or ceramic may overlap with the notch of the plastic portion.
-9-
ILX558K
3) Soldering a) Make sure the package temperature does not exceed 80C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a 30W soldering iron with a ground wire and solder each pin in less then 2 seconds. For repairs and remount, cool sufficiently. c) To dismount an imaging device, do not use a solder suction equipment. When using an electric desoldering tool, ground the controller. For the control system, use a zero cross type. 4) Dust and dirt protection a) Operate in clean environments. b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the glass surface is grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when moving to a room with great temperature differences. 5) Exposure to high temperatures or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to mechanical shocks.
- 10 -
Package Outline
Unit: mm
32.0 0.3 6.22 0.3 22 21.360 ( 5340Pixels )
22Pin DIP( 400mil )
0 to 9
12
10.0 0.3
5.0 0.3
V H 1 ( 2.9 )
No. 1Pixel ( GreenMain )
11
0.25 2.1
4.0 0.5
2.54
0.51
0.3
1. The height from the bottom to the sensor surface is 1.61 0.3mm.
PACKAGE STRUCTURE
PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS DRAWING NUMBER Plastic GOLD PLATING 42 ALLOY 2.21g LS-D19(E)
2. The thickness of the cover glass is 0.7mm, and the refractive index is 1.5.
2.8 0.5
M
10.16
- 11 -
Sony Corporation
ILX558K


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